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DTU Danchip Cleanroom Equipment Tour

A B C D E F G H I J K L M N
 
DANCHIP Cleanroom Facilities

Welcome to our Cleanroom

On the facility map we have chosen key processes for further reading. The alphabetic sequence suggests the typical production process order.

A
SSE Maximus Spin-coater Automatic Spin-Coater

A condition for lithographic processing is coating of a thin photo resist film. An SSE Maximus spin-coater for automatic processing of up too 6" wafers is available. Read more...

B
KS Aligner Lithographic Alignment 

Microstructured patterns are established through exposure of UV light. Two lithography cleanroom sections enable full end-to-

end capabilities including alignment. Read more...

C
E-beam Lithography - World class E-beam writing solution E-beam Lithrography 

Features with resolution down to 10 nm over a complete wafer. That is what DTU Danchip can offer thanks to our world-class E-beam writing solution.

Read more...

D
Nano Imprint Lithography - EVG-NIL Nano Imprint Lithography

Within the domain of top-down nanotechnology, imprint lithography is the technology of the future, driven by strong needs for reduction in production costs.

Read more...

E
Metal Deposition - Wordentech Metal Deposition

Thin layers of metals are crucial to many of DTU Danchip's customers. Our newest investment is a semi-automatic and multipurposed Wordentec QCL800. Read more...

F
Deposition of Dielectrica - PECVD3 Deposition of Dielectra 

Many micro- and nanosystems require deposition of thin layers of silicon oxides, nitrides and polysilicon. DTU Danchip's Chemical Vapor Deposition (CVD) systems can do this. Read more...

G
Dry Etching - Cluster 1 Dry Etching 

Etching is the only way to remove material and create 3-dimensional structures on micro- or nanosized devices. Reactive Ion Etching (RIE) is one way to etch. Read more...

H
Enhanced Dry Etching Enhanced Dry Etching

ICP etching is a new generation of processing technology. For deep etching of patterns in silicium and oxides this technology is recommended.

Read more...

I
Thermal Processing (ovnstak) Thermal Processing

Surface processing using heat is vital for microsystem development. DTU Danchip offers 13 different furnaces for various thermal processes. Read more...

J
Scanning Electron Microscopy Scanning Electron Microscopy

Technology in the nanometer-range requires quality microscopes. Scanning Electron Microscopes (SEM) is a tool always in high demand. Read more...

K
Nanoman - Atomic Force Microscopy Atomic Force Microscopy

Characterisation of surfaces with a resolution down to 0.5 nm. The Atomic Force Microscope (AFM) offers the highest resolution of our characterisation fleet. Read more...

L
III-V Laboratory III-V Laboratory 

In the cleanroom there is a seperate section uniquely designed for end-to-end processing of III-V materials. These are used for production of opto-electronic devices such as lasers. Read more...

M

III-V - Epitaxial Growth

Optoelectronic research requires well controlled expitaxial growth. A newly installed MOVPE systems makes this possible.

Read more...

N

Industrial partnerships

Our partners needs new types of machinery to push technology to the next level. We offer to install proprietary equipment which works in conjunction with our existing processes.

Read more...

Last updated 04.12.2009
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