DanskDTU.dkIndexContactPhone bookDTU AlumniPortalen

DTU Danchip Cleanroom Equipment Tour

A B C D E F G H I J K L M N
 
DANCHIP Cleanroom Facilities

Welcome to our Cleanroom

On the facility map we have chosen key processes for further reading. The alphabetic sequence suggests the typical production process order.

A
SSE Maximus Spin-coater Automatic Spin-Coater

A condition for lithographic processing is coating of a thin photo resist film. An SSE Maximus spin-coater for automatic processing of up to 6" wafers is available. Read more...

B
KS Aligner Lithographic Alignment 

Microstructured patterns are established through exposure with UV light. Two lithography cleanroom sections enable full end-to-

end capabilities including alignment. Read more...

C
E-beam Lithography - World class E-beam writing solution E-beam Lithrography 

We offer features with resolution down to 10 nm over a complete wafer using our world-class E-beam writing facility.

Read more...

D
Nano Imprint Lithography - EVG-NIL Nano Imprint Lithography

Within the domain of top-down nanotechnology, imprint lithography is the technology of the future, driven by strong needs for reduction in production costs.

Read more...

E
Metal Deposition - Wordentech Metal Deposition

Thin layers of metals are crucial to many of DTU Danchip's customers. We offer several tools with special capabilities. Read more...

F
Deposition of Dielectrica - PECVD3 Deposition of Dielectra 

Many micro- and nanosystems require deposition of thin layers dielectrica e.g. silicon oxide, various silicon nitrides and polysilicon. DTU Danchip's Chemical Vapor Deposition (CVD) systems can fullfill these demands. Read more...

G
Dry Etching - Cluster 1 Dry Etching 

Etching is the prefered way to remove material and create 3-dimensional structures on micro- or nanosized devices.  Read more...

H
Enhanced Dry Etching Enhanced Dry Etching

ICP etching is a new generation of processing technology. For deep etching of patterns in silicium and oxides this technology is recommended. Danchip offers 5 ICP tools for different material groups.

Read more...

I
Thermal Processing (ovnstak) Thermal Processing

Surface processing using heat is vital for microsystem development. DTU Danchip offers 13 different furnaces for various thermal processes. Read more...

J
Scanning Electron Microscopy Scanning Electron Microscopy

Technology in the nanometer-range requires quality microscopes. Our Scanning Electron Microscopes (SEM) are used mainly for process control and characterization. Read more...

K
Nanoman - Atomic Force Microscopy Atomic Force Microscopy

Characterisation of surfaces with a resolution down to 0.5 nm. The Atomic Force Microscope (AFM) offers the highest resolution of our characterisation tool park. Read more...

L
III-V Laboratory III-V Laboratory 

In the cleanroom there is a seperate section uniquely designed for end-to-end processing of III-V materials. These are used for production of optoelectronic devices. Read more...

M

III-V - Epitaxial Growth

Optoelectronic research requires well controlled epitaxial growth. A newly installed MOVPE systems makes this possible.

Read more...

N

Industrial partnerships

Our partners need special types of machinery to push technology to the next level or to ensure production capacity. We offer to install proprietary equipment which can be fully integrated in our existing process flows.

Read more...

Last updated 12.05.2010
Responsible: Jörg Hübner
Top
Oersted PladsBuilding 347DK-2800 Kgs. LyngbyTel +45 4525 5743